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LITHEN LIQUIDE 183°C FONEKONG

LITHEN LIQUIDE 183°C FONEKONG

1,900 د.ج

2UUL 183°C liquid solder paste with Sn63/Pb37 alloy, Type 4 particles, and no-clean flux. Ideal for BGA reballing, mobile phone motherboard repair, PCB repair, and SMD soldering

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Key Features
183°C eutectic melting point for fast and consistent soldering.
Sn63/Pb37 alloy provides strong, durable, and highly conductive solder joints.
Premium No-Clean flux leaves minimal residue after soldering.
Type 4 solder powder (20–38 μm) for high-precision BGA and SMD applications.
Excellent wetting and smooth solder flow.
Reduces solder bridging and solder ball formation.
Suitable for hot air rework, soldering stations, and reflow processes.

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