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LITHEN LIQUIDE UGAIN UG-158C

LITHEN LIQUIDE UGAIN UG-158C

1,650 د.ج

UGAIN UG-158C 158°C low-temperature solder paste for mobile phone repair, IC reballing, PCB repair, and micro soldering with excellent flow and reliable solder joints

التصنيف: الوسوم: , , , , العلامة التجارية:

Key Features
158°C melting point for safer soldering on sensitive components.
Designed for smartphone motherboard and micro-electronics repair.
Excellent solder flow and wetting performance.
Helps reduce thermal damage during IC rework.
Suitable for BGA reballing and SMD component replacement.
Smooth texture for precise application under microscope.

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