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LITHEN LIQUIDE 183°C YCS

LITHEN LIQUIDE 183°C YCS

1,800 د.ج

YCS 183°C liquid solder paste for mobile phone repair, BGA reballing, PCB repair, and SMD soldering. Provides excellent solder flow and reliable professional results.

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Key Features
183°C melting point for standard precision soldering applications.
Excellent wetting performance for clean and strong solder joints.
Smooth solder flow with stable viscosity.
Suitable for IC reballing and motherboard repair.
Reduces solder bridging and improves component placement.
Compatible with hot air rework stations and soldering irons.
Produces reliable electrical and mechanical connections.
Suitable for professional mobile repair workshops

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