HC-03 FIL MEL TING POINT MIJING 0.3 MM 2

950 د.ج

Buy MIJING HC-03 0.3mm solder wire with a 183°C melting point, 60/40 tin-lead alloy, and rosin core. Ideal for smartphone motherboard repair, microsoldering, and PCB electronics.

Key Features

  • Ultra-fine 0.3 mm solder wire for precision work
  • Low melting point of 183°C
  • 60% Tin (Sn) / 40% Lead (Pb) alloy
  • 1.3–1.5% rosin flux core
  • High-purity solder with minimal impurities
  • Excellent solder flow and wetting performance
  • Low smoke and easy-to-clean residue
  • High electrical conductivity

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