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2UUL BLADES DA28
1,500 د.ج
Professional 2UUL DA28 FlatCut blades for removing CPU underfill glue, solder pad residue, and PCB adhesive during smartphone motherboard and IC repair.
Key Features
- Ultra-thin FlatCut blade profile for precise adhesive removal
- Designed for CPU underfill glue and solder pad residue cleaning
- Suitable for smartphone motherboard and PCB repair
- High-strength stainless steel construction
- Excellent resistance to bending and wear
- Sharp cutting edge for controlled material removal
- Reduces the risk of damaging PCB traces when used correctly
- Ideal for IC rework and microsoldering preparation













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