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HC-03 FIL MEL TING POINT MIJING 0.3 MM 2
950 د.ج
Buy MIJING HC-03 0.3mm solder wire with a 183°C melting point, 60/40 tin-lead alloy, and rosin core. Ideal for smartphone motherboard repair, microsoldering, and PCB electronics.
Key Features
- Ultra-fine 0.3 mm solder wire for precision work
- Low melting point of 183°C
- 60% Tin (Sn) / 40% Lead (Pb) alloy
- 1.3–1.5% rosin flux core
- High-purity solder with minimal impurities
- Excellent solder flow and wetting performance
- Low smoke and easy-to-clean residue
- High electrical conductivity












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