LITHEN LIQUIDE 2UUL 138°C

Key Features
138°C ultra-low melting point for heat-sensitive repairs.
Lead-free Sn42/Bi58 alloy for environmentally friendly soldering.
No-clean formula with low residue after reflow.
Smooth solder flow and excellent wetting performance.
Produces bright, reliable, and durable solder joints.
Reduces the risk of PCB warping and component damage.
Suitable for hot air rework, BGA reballing, and SMD assembly.
Easy to apply manually or with a stencil.
Professional-grade performance for mobile phone repair technicians.