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HONG HAI TONG Blade Handle Set For Phone CPU IC Glue Removing
6,800 د.ج
HONG HAI TONG Blade Handle Set with precision replaceable blades for CPU and IC glue removal. Ideal for smartphone motherboard repair, BGA rework, and electronics maintenance.
Key Features
Professional tool for CPU and IC underfill glue removal.
Ergonomic aluminum alloy handle for a secure and comfortable grip.
Ultra-thin replaceable stainless steel blades for precise cleaning.
Ideal for removing black glue, epoxy, and adhesive around ICs.
High-strength, wear-resistant blades for extended service life.
Lightweight design for improved control during delicate repairs.
Compatible with various blade shapes for different repair tasks.
Suitable for smartphone, tablet, and PCB motherboard repair.
Designed for precision work under a repair microscope.
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