LITHEN LIQUIDE 183°C 2UUL

Key Features
183°C eutectic melting point for fast and consistent soldering.
Sn63/Pb37 alloy provides strong, durable, and highly conductive solder joints.
Premium No-Clean flux leaves minimal residue after soldering.
Type 4 solder powder (20–38 μm) for high-precision BGA and SMD applications.
Excellent wetting and smooth solder flow.
Reduces solder bridging and solder ball formation.
Suitable for hot air rework, soldering stations, and reflow processes.
Ideal for smartphone, tablet, laptop, and PCB repair.
Professional-grade formulation for chip-level repairs.